Stress induced phenomiena and reliability in 3D microelectronics, Kyoto, Japan, 28-30 May 2012

著者

• Ho, P. S.
• Hu, Chao-Kun
• Nakamoto, Mark
• Ogawa, Shinichi
• Sukharev, Valeriy
• Smith, Larry
• Zschech, Ehrenfried

書誌事項

Stress induced phenomiena and reliability in 3D microelectronics, Kyoto, Japan, 28-30 May 2012

Paul S. Ho ... [et al.], editors

（AIP conference proceedings, v. 1601）

Curran Associate, c2014

注記

Includes bibliographical references

Other editors: Chao-Kun Hu, Mark Nakamoto, Shinichi Ogawa, Valeriy Sukharev, Larry Smith, Ehrenfried Zschech

Orginally published: Melville, N.Y. : American Institute of Physics , c2014

"Print on demand"--Leaf preceding t.p

• NII書誌ID(NCID): BB24742609
• ISBN:
  • 9781632667410
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Red Hook, N.Y.
• ページ数/冊数: vi, 185 p.
• 大きさ: 28 cm
• 分類:
  • DC23 : 621.3815
  • DC23 : 620.115
• 件名:
  • LCSH : Three-dimensional integrated circuits
  • LCSH : Interconnects (Integrated circuit technology)
  • LCSH : Metal-metal bonds
  • LCSH : Strength of materials -- Congresses
  • LCSH : Nanostructured materials -- Congresses
  • LCSH : Semiconductors -- Congresses
• 親書誌ID:
  • BB2474539X