Stress induced phenomiena and reliability in 3D microelectronics, Kyoto, Japan, 28-30 May 2012

Author(s)

• Ho, P. S.
• Hu, Chao-Kun
• Nakamoto, Mark
• Ogawa, Shinichi
• Sukharev, Valeriy
• Smith, Larry
• Zschech, Ehrenfried

Bibliographic Information

Stress induced phenomiena and reliability in 3D microelectronics, Kyoto, Japan, 28-30 May 2012

Paul S. Ho ... [et al.], editors

（AIP conference proceedings, v. 1601）

Curran Associate, c2014

Note

Includes bibliographical references

Other editors: Chao-Kun Hu, Mark Nakamoto, Shinichi Ogawa, Valeriy Sukharev, Larry Smith, Ehrenfried Zschech

Orginally published: Melville, N.Y. : American Institute of Physics , c2014

"Print on demand"--Leaf preceding t.p

• NCID: BB24742609
• ISBN:
  • 9781632667410
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Red Hook, N.Y.
• Pages/Volumes: vi, 185 p.
• Size: 28 cm
• Classification:
  • DC23 : 621.3815
  • DC23 : 620.115
• Subject Headings:
  • LCSH : Three-dimensional integrated circuits
  • LCSH : Interconnects (Integrated circuit technology)
  • LCSH : Metal-metal bonds
  • LCSH : Strength of materials -- Congresses
  • LCSH : Nanostructured materials -- Congresses
  • LCSH : Semiconductors -- Congresses
• Parent Bibliography ID:
  • BB2474539X