Wide bandgap power semiconductor packaging : materials, components, and reliability
Author(s)
Bibliographic Information
Wide bandgap power semiconductor packaging : materials, components, and reliability
（Woodhead Publishing series in electronic and optical materials）
Woodhead Publishing, an imprint of Elsevier, c2018
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Note
Includes bibliographical references and index
Description and Table of Contents
Description
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.
As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.
Table of Contents
Part 1 Fundamentals and Materials 1. Introduction 2. Interconnect Technologies 3. Substrates
Part 2 Components 4. Magnetic materials
Part 3 Performance Measurement and Reliability Evaluation 5. Cooling System: Al and Cu Cooling Systems 6. Thermal Transient Testing 7. Reliability Evaluation 8. CAE Simulation
Part 4 Future Prospects 9. Future Solutions
by "Nielsen BookData"
