Wide bandgap power semiconductor packaging : materials, components, and reliability

著者

• 菅沼, 克昭 スガヌマ, カツアキ Suganuma, Katsuaki

書誌事項

Wide bandgap power semiconductor packaging : materials, components, and reliability

edited by Katsuaki Suganuma

（Woodhead Publishing series in electronic and optical materials）

Woodhead Publishing, an imprint of Elsevier, c2018

• : print

注記

Includes bibliographical references and index

内容説明・目次

内容説明

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.

目次

Part 1 Fundamentals and Materials 1. Introduction 2. Interconnect Technologies 3. Substrates Part 2 Components 4. Magnetic materials Part 3 Performance Measurement and Reliability Evaluation 5. Cooling System: Al and Cu Cooling Systems 6. Thermal Transient Testing 7. Reliability Evaluation 8. CAE Simulation Part 4 Future Prospects 9. Future Solutions

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BB26392188
• ISBN:
  • 9780081020944
• 出版国コード: uk
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Duxford
• ページ数/冊数: x, 229 p.
• 大きさ: 23 cm
• 分類:
  • DC23 : 621.317
• 件名:
  • LCSH : Wide gap semiconductors
• 親書誌ID:
  • BB10852471