25th Symposium on "Microjoining and Assembly Technology in Electronics", January 29-30, 2019, Yokohama

Author(s)
Bibliographic Information

25th Symposium on "Microjoining and Assembly Technology in Electronics", January 29-30, 2019, Yokohama

溶接学会, 2019.1

Other Title

Mate 2019

第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.25, 2019

Proceedings of the 25th Symposium on Microjoining and Assembly Technology in Electronics, Vol.25, 2019

Note

Sponsored by Committee on Manufacturing Science and Technology in Electronics (SPS), Microjoining Commission (JWS)

参考文献あり

抄録は英語

Details
  • NCID
    BB28874973
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    418p
  • Size
    30cm
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