Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages

Author(s)

• Tegehall, P. E.
• Dunn, Barrie D.
• European Space Agency

Bibliographic Information

Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages

P.-E. Tegehall, B.D. Dunn

（ESA STM, 267）

ESA Publications Division, c2003

Note

"March 2003."

Includes bibliographical references

Details

• NCID: BD06105390
• ISBN:
  • 9290923628
• LCCN: 2003504225
• Country Code: ne
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Noordwijk
• Pages/Volumes: iv, 40 p.
• Size: 30 cm
• Classification:
  • LCC : TK7870.16
• Subject Headings:
  • LCSH : Ball grid array technology
• Parent Bibliography ID:
  • BA33622225