Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages

著者

• Tegehall, P. E.
• Dunn, Barrie D.
• European Space Agency

書誌事項

Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages

P.-E. Tegehall, B.D. Dunn

（ESA STM, 267）

ESA Publications Division, c2003

注記

"March 2003."

Includes bibliographical references

詳細情報

• NII書誌ID(NCID): BD06105390
• ISBN:
  • 9290923628
• LCCN: 2003504225
• 出版国コード: ne
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Noordwijk
• ページ数/冊数: iv, 40 p.
• 大きさ: 30 cm
• 分類:
  • LCC : TK7870.16
• 件名:
  • LCSH : Ball grid array technology
• 親書誌ID:
  • BA33622225