Advances in electronic packaging -- 2005 : presented at 2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, July 17-22, 2005, San Francisco, California, USA

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Advances in electronic packaging -- 2005 : presented at 2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, July 17-22, 2005, San Francisco, California, USA

sponsored by Electronic and Photonic Packaging Division, ASME

American Society of Mechanical Engineers, c2005

  • part A

タイトル別名

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems

2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, July 17-22, 2005, San Francisco, California, USA

Integration and Packaging of MEMS, NEMS, and electronic systems

InterPACK'05

InterPACK 2005

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注記

At head of title: Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems

" ... InterPACK'05 ..."--P. iii

Includes bibliographical references and author index

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