American Society of Mechanical Engineers. Electronic and Photonic Packaging Division

ID:DA15291031

別名: EPPD

American Society of Mechanical Engineers. Electronics and Photonics Packaging Division

関連著者名: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

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1

Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS--2011 : presented at ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS : July 6-8, 2011, Portland, Oregon, USA

ASME c2012

v. 1 : pbk. , v. 2 : pbk.

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Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA

sponsored by the Electronic and Photonic Packaging Division, ASME

American Society of Mechanical Engineers c2007 EPP v. 6

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3

Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems - 2005 : presented at the 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orland, Florida USA

sponsored by the Electronic and Photonic Packaging Division, ASME

American Society of Mechanical Engineers c2005 EPP v. 5

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4

Electronic and photonic packaging, electrical systems design and photonics, and nanotechnology : presented at the 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California USA

sponsored by the Electronic and Photonic Packaging Division, ASME

American Society of Mechanical Engineers c2004 EPP v. 4

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5

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

sponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.]

American Society of Mechanical Engineers c2003 EPP v. 3

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