Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly

著者

• Hwang, Jennie S.

書誌事項

Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly

Jennie S. Hwang

Van Nostrand Reinhold, c1989

注記

Includes bibliographies and index

詳細情報

• NII書誌ID(NCID): BA07273821
• ISBN:
  • 0442207549
• LCCN: 88028015
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: und
• 出版地: New York
• ページ数/冊数: xxii, 456 p.
• 大きさ: 24 cm
• 分類:
  • LCC : TK7868.P7
  • DC19 : 621.381/74
• 件名:
  • LCSH : Printed circuits -- Design and construction
  • LCSH : Solder pastes
  • LCSH : Surface mount technology