Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991

著者

• Chen, W. T.
• Engel, Paul C.
• Jahsman, W. E. (William E.)
• American Society of Mechanical Engineers. Winter Meeting
• American Society of Mechanical Engineers. Applied Mechanics Division
• American Society of Mechanical Engineers. Electronic Packaging Division

書誌事項

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991

sponsored by the Applied Mechanics Division, ASME, the Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman

（AMD, v. 131）（EEP, v. 1）

ASME, c1991

注記

Includes bibliographical references and index

詳細情報

• NII書誌ID(NCID): BA14250043
• ISBN:
  • 0791808963
• LCCN: 91058586
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York, N.Y.
• ページ数/冊数: v, 153 p.
• 大きさ: 28 cm
• 分類:
  • LCC : IN PROCESS
• 親書誌ID:
  • BA00053361
  • BA14250087