Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

Author(s)

• Lee, Y. C.
• Bennett, T. J. (Timothy J.)
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• American Society of Mechanical Engineers. Production Engineering Division
• American Society of Mechanical Engineers. Winter Meeting

Bibliographic Information

Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

sponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett

（EEP, vol. 2）（PED, vol. 60）

The Society, c1992

Note

Includes bibliographical references and index

• NCID: BA19552232
• ISBN:
  • 0791811123
• LCCN: 92056567
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: v, 211 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Congreses
  • LCSH : Manufacturing processes -- Congresses
• Parent Bibliography ID:
  • BA14250087
  • BA00053430