Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

著者

• Lee, Y. C.
• Bennett, T. J. (Timothy J.)
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• American Society of Mechanical Engineers. Production Engineering Division
• American Society of Mechanical Engineers. Winter Meeting

書誌事項

Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

sponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett

（EEP, vol. 2）（PED, vol. 60）

The Society, c1992

注記

Includes bibliographical references and index

詳細情報

• NII書誌ID(NCID): BA19552232
• ISBN:
  • 0791811123
• LCCN: 92056567
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York
• ページ数/冊数: v, 211 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Congreses
  • LCSH : Manufacturing processes -- Congresses
• 親書誌ID:
  • BA14250087
  • BA00053430