Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

Author(s)

• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• Nguyen, Luu T.
• Pecht, Michael G.

Bibliographic Information

Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by L. T. Nguyen, M.G. Pecht

（EEP, vol. 6）

American Society of Mechanical Engineers, c1993

Details

• NCID: BA21709370
• ISBN:
  • 0791810356
• LCCN: 93093270
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York, N.Y.
• Pages/Volumes: v, 131 p.
• Size: ill. ; 28 cm
• Parent Bibliography ID:
  • BA14250087