Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

著者

• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• Nguyen, Luu T.
• Pecht, Michael G.

書誌事項

Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by L. T. Nguyen, M.G. Pecht

（EEP, vol. 6）

American Society of Mechanical Engineers, c1993

詳細情報

• NII書誌ID(NCID): BA21709370
• ISBN:
  • 0791810356
• LCCN: 93093270
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York, N.Y.
• ページ数/冊数: v, 131 p.
• 大きさ: ill. ; 28 cm
• 親書誌ID:
  • BA14250087