Manufacturing aspects in electronic packaging 1993 : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

Bibliographic Information

Manufacturing aspects in electronic packaging 1993 : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

sponsored by the Production Engineering Division and the Electrical and Electronic Packaging Division, ASME ; edited by Y.C. Lee ... [et al.]

(PED, vol. 65)(EEP, vol. 5)

American Society of Mechanical Engineers, c1993

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  • EEP

    ASME

  • PED

    American Society of Mechanical Engineers

Details

  • NCID
    BA21718247
  • ISBN
    • 0791810321
  • LCCN
    93073267
  • Country Code
    us
  • Title Language Code
    eng
  • Text Language Code
    eng
  • Place of Publication
    New York, N.Y.
  • Pages/Volumes
    iv, 125 p.
  • Size
    ill. ; 28 cm
  • Parent Bibliography ID
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