Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993

著者

• ASME International Electronics Packaging Conference
• Chen, William T.
• Engel, Peter A.
• American Society of Mechanical Engineers

書誌事項

Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993

sponsored by the American Society of Mechanical Engineers ; edited by P.A. Engel, W.T. Chen

（EEP, vol. 4-1）

American Society of Mechanical Engineers, c1993

詳細情報

• NII書誌ID(NCID): BA21835499
• ISBN:
  • 0791806863
• LCCN: 92053846
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York (345 E. 47th St., New York)
• ページ数/冊数: xi, 550 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Congresses
• 親書誌ID:
  • BA14250087