CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

Author(s)

• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• Agonafer, D.
• Fulton, Robert E.

Bibliographic Information

CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by D. Agonafer, R.E. Fulton

（EEP, vol. 9）

American Society of Mechanical Engineers, c1994

Details

• NCID: BA24206911
• ISBN:
  • 0791814602
• LCCN: 94079553
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: v, 89 p.
• Size: 28 cm
• Parent Bibliography ID:
  • BA14250087