CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

著者

• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• Agonafer, D.
• Fulton, Robert E.

書誌事項

CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by D. Agonafer, R.E. Fulton

（EEP, vol. 9）

American Society of Mechanical Engineers, c1994

• NII書誌ID(NCID): BA24206911
• ISBN:
  • 0791814602
• LCCN: 94079553
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York
• ページ数/冊数: v, 89 p.
• 大きさ: 28 cm
• 親書誌ID:
  • BA14250087