Subsystem packaging

Author(s)

• Tummala, Rao R.
• Rymaszewski, Eugene J.
• Klopfenstein, Alan G.

Bibliographic Information

Subsystem packaging

edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein

（Microelectronics packaging handbook, Part 3）

Chapman & Hall, c1997

2nd ed.

Note

Includes index.

Details

• NCID: BA31828445
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: xxix, 628p
• Size: 24cm
• Parent Bibliography ID:
  • BA31826960