ID:DA03687931
同姓同名の著者を検索
Rao R. Tummala, editor.
McGraw-Hill c2001
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co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology (CPMT) ; participating societies: American Society of Metals ...[et al.] ; general chair, C.P. Wong ; technical chairs, George White, Rao Tummala
IMAPS , IEEE [1998]
:softbound
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edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Chapman & Hall c1997 2nd ed. Microelectronics packaging handbook Part 2
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Chapman & Hall c1997 2nd ed. Microelectronics packaging handbook Part 3
Chapman & Hall c1997 2nd ed. Microelectronics packaging handbook Part 1
R.R.Tummala,E.J. Rymaszewski編
日経BP社 1991.3
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edited by Rao R. Tummala, Eugene J. Rymaszewski
Van Nostrand Reinhold c1989
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