Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
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Bibliographic Information
Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
（AMD, vol. 222）（EEP, vol. 20）
American Society of Mechanical Engineers, c1997
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Fracture mechanics in electronic packaging
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Note
"Papers that were presented at the Symposium on Application of Fracture Mechanics in Electronic Packaging"--P. iii
Includes bibliographical references and index
Description and Table of Contents
Description
Twenty-three technical papers from the November 1997 symposium show how applications of the mechanics of fracture help to maintain the reliability of modern electronic components even while they become faster, smaller, and cheaper.
by "Nielsen BookData"
