Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

Author(s)

• Suhling, J. C. (Jeffrey C.)
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• American Society of Mechanical Engineers. Applied Mechanics Division

Bibliographic Information

Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling

（EEP, vol. 13）（AMD, vol. 214）

American Society of Mechanical Engineers, c1995

Note

Includes bibliographical references and index

• NCID: BA44129777
• ISBN:
  • 0791817393
• LCCN: 95081275
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: v, 117 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Mechanics, Applied -- Congresses
• Parent Bibliography ID:
  • BA14250087
  • BA00053361