Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

Author(s)

• Wu, Tien Y.
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• American Society of Mechanical Engineers. Materials Division

Bibliographic Information

Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu ... [et al.]

（EEP, v. 11）（MD, v. 64）

American Society of Mechanical Engineers, c1995

Note

Papers presented at a symposium held during the 1995 ASME International Mechancial Engineering Congress and Exposition

Includes bibliographical references and index

Description and Table of Contents

Description

Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fracture mechanics. Among the range of topics discussed at the symposium were: analytical and numerical anal

by "Nielsen BookData"

Details

• NCID: BA44130608
• ISBN:
  • 0791817369
• LCCN: 95081270
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: vi, 271 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Fracture mechanics -- Congresses
• Parent Bibliography ID:
  • BA14250087
  • BA07638589