Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
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書誌事項
Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
(EEP, v. 11)(MD, v. 64)
American Society of Mechanical Engineers, c1995
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注記
Papers presented at a symposium held during the 1995 ASME International Mechancial Engineering Congress and Exposition
Includes bibliographical references and index
内容説明・目次
内容説明
Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fracture mechanics. Among the range of topics discussed at the symposium were: analytical and numerical anal
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