Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

Author(s)

• Agonafer, D.
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

Bibliographic Information

Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]

（EEP, vol. 18）

American Society of Mechanical Engineers, c1996

Note

Includes bibliographical references and index

Description and Table of Contents

Description

Proceedings of the November 1996 symposium sponsored by the Computer Aided Design for Electronic Packaging Committee of the Electrical and Electronic Packaging Division. Contains 15 papers, including several related to the use of computer simulations to solve complex packaging problems related to th

by "Nielsen BookData"

Details

• NCID: BA44130798
• ISBN:
  • 0791815536
• LCCN: 96079040
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York, N.Y.
• Pages/Volumes: v, 123 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.25
• Subject Headings:
  • LCSH : Electronic packaging -- Cooling -- Congresses
  • LCSH : Heat sinks (Electronics) -- Congresses
  • LCSH : CAD/CAM systems -- Congresses
  • LCSH : Computer-aided engineering -- Congresses
  • LCSH : Computer-aided design -- Congresses
• Parent Bibliography ID:
  • BA14250087