Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

Author(s)

• Ume, Charles
• Yeh, Chao-pin
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

Bibliographic Information

Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Chao-pin Yeh, Charles Ume

（EEP, vol. 17）

American Society of Mechanical Engineers, c1996

Note

Includes bibliographical references and index

Description and Table of Contents

Description

Presents 15 papers from the November 1996 congress reflecting the state-of-the-art modeling, simulation, and sensing technologies used in emerging electronic packaging applications, especially flip chip and ball grid array (BGA). Subjects include curing analysis of a flip- chip-on-board electronic p

by "Nielsen BookData"

Details

• NCID: BA44131043
• ISBN:
  • 079181548X
• LCCN: 96078690
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York, N.Y.
• Pages/Volumes: v, 125 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Multichip modules (Microelectronics) -- Congresses
• Parent Bibliography ID:
  • BA14250087