Structural analysis in microelectronics and fiber optics, 1996 : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

Author(s)

• Suhir, Ephraim
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• International Mechanical Engineering Congress and Exposition

Bibliographic Information

Structural analysis in microelectronics and fiber optics, 1996 : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir

（EEP, vol. 16）

American Society of Mechanical Engineers, c1996

Note

Includes bibliographical references and index

Description and Table of Contents

Description

Proceedings of the November 1996 symposium. Contains 18 papers arranged in sections on structural reliability and dynamics, structural analysis of IC packages, solder alloys and joints, and fiber-optic and optoelectronic structures. Specific topics include singular solutions of interfacial stresses

by "Nielsen BookData"

Details

• NCID: BA44131236
• ISBN:
  • 0791815390
• LCCN: 96078681
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: vi, 225 p.
• Size: 28 cm
• Classification:
  • LCC : TK7874
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Fiber optics -- Congresses
  • LCSH : Structural analysis (Engineering) -- Congresses
• Parent Bibliography ID:
  • BA14250087