Structural analysis in microelectronics and fiber optics, 1996 : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

著者

• Suhir, Ephraim
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• International Mechanical Engineering Congress and Exposition

書誌事項

Structural analysis in microelectronics and fiber optics, 1996 : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir

（EEP, vol. 16）

American Society of Mechanical Engineers, c1996

注記

Includes bibliographical references and index

内容説明・目次

内容説明

Proceedings of the November 1996 symposium. Contains 18 papers arranged in sections on structural reliability and dynamics, structural analysis of IC packages, solder alloys and joints, and fiber-optic and optoelectronic structures. Specific topics include singular solutions of interfacial stresses

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BA44131236
• ISBN:
  • 0791815390
• LCCN: 96078681
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York
• ページ数/冊数: vi, 225 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7874
  • DC21 : 621.381/046
• 件名:
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Fiber optics -- Congresses
  • LCSH : Structural analysis (Engineering) -- Congresses
• 親書誌ID:
  • BA14250087