Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii

Author(s)

• Pacific RIM/ASME International International Intersociety Electronic & Photonic Packaging Conference
• Suhir, Ephraim
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

Bibliographic Information

Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir ... [et al.]

（EEP, vol. 19）

American Society of Mechanical Engineers, c1997

• :set
• 1
• 2

Other Title

Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference

INTERpack '97

Note

Includes bibliographic references and indexes

Description and Table of Contents

Description

These proceedings contain 302 papers presented at the June, 1997 conference. The papers are organized into five topical tracks: packaging technologies; emerging technologies; design, modeling and characterization; reliability; and thermal management. Topics within these tracks include advanced inter

by "Nielsen BookData"

Details

• NCID: BA44131564
• ISBN:
  • 0791815595
• LCCN: 97073292
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York, N.Y
• Pages/Volumes: 2 v.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
• Parent Bibliography ID:
  • BA14250087