Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii
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Bibliographic Information
Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii
（EEP, vol. 19）
American Society of Mechanical Engineers, c1997
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Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference
INTERpack '97
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Includes bibliographic references and indexes
Description and Table of Contents
Description
These proceedings contain 302 papers presented at the June, 1997 conference. The papers are organized into five topical tracks: packaging technologies; emerging technologies; design, modeling and characterization; reliability; and thermal management. Topics within these tracks include advanced inter
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