Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii

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Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir ... [et al.]

（EEP, vol. 19）

American Society of Mechanical Engineers, c1997

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タイトル別名

Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference

INTERpack '97

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Includes bibliographic references and indexes

内容説明・目次

内容説明

These proceedings contain 302 papers presented at the June, 1997 conference. The papers are organized into five topical tracks: packaging technologies; emerging technologies; design, modeling and characterization; reliability; and thermal management. Topics within these tracks include advanced inter

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