Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii

Author(s)

• Pacific RIM/ASME International International Intersociety Electronic & Photonic Packaging Conference
• Agonafer, D.
• Saka, Masumi
• Lee, Yung-Cheng
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

Bibliographic Information

Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee

（EEP, vol. 26）

American Society of Mechanical Engineers, c1999

• :set
• 1
• 2

Other Title

Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference

INTERpack '99

Note

Includes bibliographic references and indexes

Details

• NCID: BA44132104
• ISBN:
  • 0791816125
• LCCN: 97073292
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York, N.Y
• Pages/Volumes: 2 v.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
• Parent Bibliography ID:
  • BA14250087