Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

著者

• Liu, S. (Sheng)
• Qian, Zhengfang
• Yeh, Chao-pin
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• International Mechanical Engineering Congress and Exposition
• ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures (1998 : Anaheim, Calif.)

書誌事項

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh

（EEP, vol. 24）

American Society of Mechanical Engineers, c1998

タイトル別名

Characterization of evolving packaging materials and structures

Evolving packaging materials and structures

Packaging materials and structures

注記

"Papers presented at the annual ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures"--Foreword

Includes bibliographical references and author index

• NII書誌ID(NCID): BA44132647
• ISBN:
  • 0791815919
• LCCN: 98074430
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York, N.Y.
• ページ数/冊数: v, 141 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Testing Congresses
  • LCSH : Electronic packaging -- Materials -- Fatigue Congresses
  • LCSH : Thermal stresses Congresses
  • LCSH : Deformation (Mechanics) Congresses
• 親書誌ID:
  • BA14250087