Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

Author(s)

• Liu, S. (Sheng)
• Qian, Zhengfang
• Yeh, Chao-pin
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• International Mechanical Engineering Congress and Exposition
• ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures (1998 : Anaheim, Calif.)

Bibliographic Information

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh

（EEP, vol. 24）

American Society of Mechanical Engineers, c1998

Other Title

Characterization of evolving packaging materials and structures

Evolving packaging materials and structures

Packaging materials and structures

Note

"Papers presented at the annual ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures"--Foreword

Includes bibliographical references and author index

Details

• NCID: BA44132647
• ISBN:
  • 0791815919
• LCCN: 98074430
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York, N.Y.
• Pages/Volumes: v, 141 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Testing Congresses
  • LCSH : Electronic packaging -- Materials -- Fatigue Congresses
  • LCSH : Thermal stresses Congresses
  • LCSH : Deformation (Mechanics) Congresses
• Parent Bibliography ID:
  • BA14250087