CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
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Bibliographic Information
CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
（EEP, vol. 23）（HTD, vol. 356）
American Society of Mechanical Engineers, c1997
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Includes bibliographical references and index
Description and Table of Contents
Description
Proceedings of the November 1997 symposium. Twelve papers relate to the use of computer simulations to solve complex packaging problems related to thermo/mechanical problems. Topics include improving electronic packaging manufacturing through product and process-driven analysis; thermo-mechanical an
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