Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

著者

• Suhling, J. C. (Jeffrey C.)
• Liechti, K. M.
• Liu, S. (Sheng)
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• American Society of Mechanical Engineers. Applied Mechanics Division

書誌事項

Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu

（EEP, vol. 22）（AMD, vol. 226）

American Society of Mechanical Engineers, c1997

注記

Includes bibliographical references and author index

内容説明・目次

内容説明

Proceedings of the November 1997 symposium, a forum for presentation of research in all aspects of experimental mechanics as applied to electronic packaging. Session topics included test chips, sensors, optical methods, micromechanical testing, and mechanics of thin film debonding.

「Nielsen BookData」 より

• NII書誌ID(NCID): BA4413348X
• ISBN:
  • 0791818500
• LCCN: 97077357
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York
• ページ数/冊数: vi, 136 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Mechanics, Applied -- Congresses
• 親書誌ID:
  • BA14250087
  • BA00053361