Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

Author(s)

• Suhling, J. C. (Jeffrey C.)
• Liechti, K. M.
• Liu, S. (Sheng)
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• American Society of Mechanical Engineers. Applied Mechanics Division

Bibliographic Information

Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu

（EEP, vol. 22）（AMD, vol. 226）

American Society of Mechanical Engineers, c1997

Note

Includes bibliographical references and author index

Description and Table of Contents

Description

Proceedings of the November 1997 symposium, a forum for presentation of research in all aspects of experimental mechanics as applied to electronic packaging. Session topics included test chips, sensors, optical methods, micromechanical testing, and mechanics of thin film debonding.

by "Nielsen BookData"

Details

• NCID: BA4413348X
• ISBN:
  • 0791818500
• LCCN: 97077357
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: vi, 136 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Mechanics, Applied -- Congresses
• Parent Bibliography ID:
  • BA14250087
  • BA00053361