Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

Author(s)

• Suhir, Ephraim
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• International Mechanical Engineering Congress and Exposition

Bibliographic Information

Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir

（EEP, vol. 21）

American Society of Mechanical Engineers, c1997

Note

Includes bibliographical references and author index

Details

• NCID: BA44133683
• ISBN:
  • 079181839X
• LCCN: 97076716
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: v, 272 p.
• Size: 28 cm
• Classification:
  • LCC : TK7874
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Fiber optics -- Congresses
  • LCSH : Structural analysis (Engineering) -- Congresses
• Parent Bibliography ID:
  • BA14250087