Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

著者

• Suhir, Ephraim
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• International Mechanical Engineering Congress and Exposition

書誌事項

Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir

（EEP, vol. 21）

American Society of Mechanical Engineers, c1997

注記

Includes bibliographical references and author index

内容説明・目次

内容説明

A selection of 16 papers applying theoretical and experimental methods of structural analysis and engineering mechanics to various mechanical, materials, and manufacturing problems in microelectronics and photonics. Among the topics are assessing chip-scale package design options, the experimental e

「Nielsen BookData」 より

• NII書誌ID(NCID): BA44133683
• ISBN:
  • 079181839X
• LCCN: 97076716
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York
• ページ数/冊数: v, 272 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7874
  • DC21 : 621.381/046
• 件名:
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Fiber optics -- Congresses
  • LCSH : Structural analysis (Engineering) -- Congresses
• 親書誌ID:
  • BA14250087