Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

Author(s)

• Suhir, Ephraim
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• International Mechanical Engineering Congress and Exposition

Bibliographic Information

Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir

（EEP, vol. 21）

American Society of Mechanical Engineers, c1997

Note

Includes bibliographical references and author index

Description and Table of Contents

Description

A selection of 16 papers applying theoretical and experimental methods of structural analysis and engineering mechanics to various mechanical, materials, and manufacturing problems in microelectronics and photonics. Among the topics are assessing chip-scale package design options, the experimental e

by "Nielsen BookData"

• NCID: BA44133683
• ISBN:
  • 079181839X
• LCCN: 97076716
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: v, 272 p.
• Size: 28 cm
• Classification:
  • LCC : TK7874
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Fiber optics -- Congresses
  • LCSH : Structural analysis (Engineering) -- Congresses
• Parent Bibliography ID:
  • BA14250087