Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

Author(s)

• Amon, Cristina H.
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Heat Transfer Division
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

Bibliographic Information

Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Heat Transfer Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Cristina H. Amon ... [et al.]

（HTD, vol. 319）（EEP, vol. 15）

American Society of Mechanical Engineers, c1995

Note

Includes bibliographical references and index

• NCID: BA44439220
• ISBN:
  • 0791817539
• LCCN: 95081257
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: vi, 233 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.25
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic systems -- Cooling -- Congresses
  • LCSH : Electronic apparatus and appliances -- Cooling -- Congresses
  • LCSH : Electronic apparatus and appliances -- Thermal properties -- Congresses
• Parent Bibliography ID:
  • BA00053441
  • BA14250087