Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

Author(s)

• Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• Suhir, Ephraim

Bibliographic Information

Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir

（EEP, vol. 25）

The American Society of Mechanical Engineers, c1998

• : pbk

Note

Includes bibliographical references and index

"In cooperation with IEEE Components, Packaging, and Manufacturing Technology(CPMT) Society, International Microelectronics and Packaging Society(IMAPS), Society of Plastics Engineering(SPE), The Association française de mecanique(AFM)

Details

• NCID: BA48127128
• ISBN:
  • 0791818772
• LCCN: 98074670
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: vii, 349 p.
• Size: 28 cm
• Classification:
  • LCC : TK7871.15.P6
  • DC21 : 621.3815
• Subject Headings:
  • LCSH : Polymers -- Mechanical properties Congresses
  • LCSH : Integrated circuits -- Reliability Congresses
  • LCSH : Electronic packaging -- Materials Congresses
  • LCSH : Polymeric composites -- Testing Congresses
• Parent Bibliography ID:
  • BA14250087