Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

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Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir

(EEP, vol. 25)

The American Society of Mechanical Engineers, c1998

  • : pbk

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Includes bibliographical references and index

"In cooperation with IEEE Components, Packaging, and Manufacturing Technology(CPMT) Society, International Microelectronics and Packaging Society(IMAPS), Society of Plastics Engineering(SPE), The Association française de mecanique(AFM)

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