Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

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Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir

(EEP, vol. 25)

The American Society of Mechanical Engineers, c1998

  • : pbk

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Includes bibliographical references and index

"In cooperation with IEEE Components, Packaging, and Manufacturing Technology(CPMT) Society, International Microelectronics and Packaging Society(IMAPS), Society of Plastics Engineering(SPE), The Association française de mecanique(AFM)

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Proceedings of the August 1998 conference. Aspects of fuels and combustion technologies discussed (each by multiple contributors) include the upgrading of fuel handling systems to meet the generating demands for the next millennium; low NOx burner applications; low cost solutions to utility NOx comp

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