Proceedings : 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 15-18, 1998

著者

• International Symposium on Advanced Packaging Materials
• International Microelectronics and Packaging Society
• Components, Packaging & Manufacturing Technology Society
• American Society of Metals
• Wong, C. P.
• White, George
• Tummala, Rao R.

書誌事項

Proceedings : 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 15-18, 1998

co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology (CPMT) ; participating societies: American Society of Metals ...[et al.] ; general chair, C.P. Wong ; technical chairs, George White, Rao Tummala

IMAPS , IEEE, [1998]

• :softbound

タイトル別名

4th International Symposium on Advanced Packaging Materials

4th International Symposium and Exhibition on Advanced Packaging Materials

1998 proceedings, International Symposium and Exhibition on Advanced Packaging Materials

98EX153

注記

"IEEE catalog number 98EX153"--verso of T.p

Includes bibliographical references and author index

• NII書誌ID(NCID): BA48882591
• ISBN:
  • 0780347951
• LCCN: 98149250
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Reston, Virginia,Piscataway, New Jersey
• ページ数/冊数: 300 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Materials -- Congresses