Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

Author(s)

• Ume, Charles
• Chao, Pin-Yeh
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Manufacturing Engineering Division
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

Bibliographic Information

Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh

（MED, vol. 3）（EEP, vol. 14）

American Society of Mechanical Engineers, c1995

Note

Includes bibliographical references and index

• NCID: BA49148371
• ISBN:
  • 0791817407
• LCCN: 95081274
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: v, 123 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Equipment and supplies -- Congresses
  • LCSH : Detectors -- Industrial applications -- Congresses
• Parent Bibliography ID:
  • BA28578656
  • BA14250087