Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

Bibliographic Information

Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh

(MED, vol. 3)(EEP, vol. 14)

American Society of Mechanical Engineers, c1995

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Includes bibliographical references and index

Related Books: 1-2 of 2
  • MED

    American Society of Mechanical Engineers

  • EEP

    ASME

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