Packaging, reliability and manufacturing issues associated with electronic and photonic products : presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York

Bibliographic Information

Packaging, reliability and manufacturing issues associated with electronic and photonic products : presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York

sponsored by the Electronic and Photonic Packaging Division, ASME ; edited by I. Charles Ume ... [et al.]

(EPP, vol. 1)

American Society of Mechanical Engineers, c2001

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Note

Includes bibliographical references and index

Related Books: 1-1 of 1

  • EPP

    American Society of Mechanical Engineers

Details

  • NCID
    BA61327085
  • ISBN
    • 0791835650
  • LCCN
    2001134005
  • Country Code
    us
  • Title Language Code
    eng
  • Text Language Code
    eng
  • Place of Publication
    New York, N.Y.
  • Pages/Volumes
    vii, 305 p.
  • Size
    28 cm
  • Parent Bibliography ID
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