著者
書誌事項
EPP
American Society of Mechanical Engineers
- タイトル別名
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Electronic and Photonic Packaging
この図書・雑誌をさがす
関連文献： 6件中 1-6を表示
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1
- Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA
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sponsored by the Electronic and Photonic Packaging Division, ASME
American Society of Mechanical Engineers c2007 EPP v. 6
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2
- Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems - 2005 : presented at the 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orland, Florida USA
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sponsored by the Electronic and Photonic Packaging Division, ASME
American Society of Mechanical Engineers c2005 EPP v. 5
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3
- Electronic and photonic packaging, electrical systems design and photonics, and nanotechnology : presented at the 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California USA
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sponsored by the Electronic and Photonic Packaging Division, ASME
American Society of Mechanical Engineers c2004 EPP v. 4
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4
- Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.
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sponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.]
American Society of Mechanical Engineers c2003 EPP v. 3
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5
- Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology 2002 : presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana
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sponsored by the Electronic and Photonic Packaging Division, ASME
American Society of Mechanical Engineers c2002 EPP vol. 2
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6
- Packaging, reliability and manufacturing issues associated with electronic and photonic products : presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York
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sponsored by the Electronic and Photonic Packaging Division, ASME ; edited by I. Charles Ume ... [et al.]
American Society of Mechanical Engineers c2001 EPP vol. 1
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