Packaging, reliability and manufacturing issues associated with electronic and photonic products : presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York
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Packaging, reliability and manufacturing issues associated with electronic and photonic products : presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York
(EPP, vol. 1)
American Society of Mechanical Engineers, c2001
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Includes bibliographical references and index