Stress-induced phenomena in metallization : seventh international workshop on stress-induced phenomena in metallization : Austin, Texas, 14-16 June 2004

書誌事項

Stress-induced phenomena in metallization : seventh international workshop on stress-induced phenomena in metallization : Austin, Texas, 14-16 June 2004

editors, Paul S. Ho ... [et al.]

(AIP conference proceedings, 741)

American Institute of Physics, c2004

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注記

Another editors: Shefford P. Baker, Tomoji Nakamura, Cynthia A. Volkert

Includes indexes

内容説明・目次

内容説明

These proceedings contain new research results and advances in basic understanding of stress-induced phenomena in metallization. Papers cover results on electromigration, thermal stresses and void formation in copper-low k interconnect structures.

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詳細情報

  • NII書誌ID(NCID)
    BA71166211
  • ISBN
    • 0735402256
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Melville, N.Y.
  • ページ数/冊数
    vii, 272 p.
  • 大きさ
    25 cm
  • 親書誌ID
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