Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

著者

• Lee, S. W. Ricky
• American Society of Mechanical Engineers. Electronic and Photonic Packaging Division
• International Mechanical Engineering Congress and Exposition

書誌事項

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

sponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.]

（EPP, v. 3）

American Society of Mechanical Engineers, c2003

注記

Includes bibliographical references and index

• NII書誌ID(NCID): BA75359534
• ISBN:
  • 0791837149
• LCCN: 2005297971
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York, N.Y.
• ページ数/冊数: xi, 893 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
• 件名:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Photonics -- Congresses
  • LCSH : Nanotechnology -- Congresses
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Surface mount technology -- Congresses
  • LCSH : Microelectromechanical systems -- Congresses
  • LCSH : Integrated circuits -- Wafer-scale integration -- Congresses
• 親書誌ID:
  • BA6132699X